10043-35-3 | Boric Acid

Chemical type

• Metalloid compound
• Essential micronutrient

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• Weak acid, buffer agent

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Key properties

• Transported by NIPs (NIP II and NIP III groups) and XIPs
• Enhances plant tolerance to stress
• Permeability modulated by ar/R filter variations

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• Used in electroplating bath as pH buffer
• Stabilizes plating solution

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• Nutrient uptake in boron-deficient soils
• Improves salinity and drought tolerance
• Involved in cell wall stability and growth

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• Additive in copper electroplating solution

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Classification by use

• Solutes transported by AQPs for micronutrient homeostasis
• Chemicals enhancing abiotic stress resistance

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• Chemicals used in electroplating baths

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A trustworthy factory and manufacturer

1. [Cite:1] Systematic Review of Plant AQPs: Molecular mechanisms, intracellular trafficking, and emerging roles in stress adaptation, Current Plant Biology, Volume 45, January 2026, 100586
2. [Cite:2] A novel electrochemical deposition of copper conductor on flexible printed circuit boards, Electrochemistry Communications, Volume 183, February 2026, 108090